Yerevan
Svetlana Chumachenko
EWDTS 2016
Vladimir Hahanov
EWDTS 2016
Wonderful student
Wonderful student
EWDTS 2018
EWDTS 2017
EWDTS 2017
EWDTS 2017
EWDTS 2017
EWDTS 2018
Call For Papers
The main target of the IEEE East-West Design & Test Symposium (EWDTS) is to exchange experiences between scientists and technologies from Eastern and Western Europe, as well as North America and other parts of the world, in the field of testing, diagnosis, repair of microelectronic systems, and also cyber security, automotive, IoT, artificial intelligence. The symposium is typically held in countries around East Europe, the Black Sea, the Balkans and Central Asia region. We cordially invite you to participate and submit your contributions to EWDTS-2025 which covers (but is not limited to) the following topics . Conference content will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. IEEE reserves the right to exclude a paper from distribution after the conference, including IEEE Xplore® Digital Library, if the paper is not presented by the author at the conference.
Deadlines
Submission deadline:
July 1, 2025
Notification of acceptance:
August 15, 2025
Final Paper Submission (after review):
August 30, 2025
EWDTS-2025 topics:
- Analog, Mixed-Signal and RF Test
- ATPG and High-Level TPG
- Automotive Reliability & Test
- Built-In Self Test
- Debug and Diagnosis
- Defect/Fault Tolerance and Reliability
- Design Verification and Validation
- EDA Tools for Design and Test
- Embedded Software
- Failure Analysis & Fault Modeling
- Functional Safely
- High-level Synthesis
- High-Performance Networks and Systems on a Chip
- Internet of Things Design & Test
- Low-power Design
- Memory and Processor Test
- Modeling & Fault Simulation
- Network-on-Chip Design & Test
- Flexible and Printed Electronics
- Applied Electronics Automotive/Mechatronics
- Algorithms
- Object-Oriented System Specification and Design
- On-Line Testing
- 3D and Chiplet Test & Repair
- Power Issues in Design & Test
- Real Time Embedded Systems
- Reliability of Digital Systems
- Reliability, Availability, Serviceability (RAS)
- Scan-Based Techniques
- Self-Repair and Reconfigurable Architectures
- Silicon Lifecycle Management (SLM)
- Signal and Information Processing in Radio, Communication, Control and Measurement Engineering
- System Level Modeling, Simulation & Test Generation
- System-in-Package and 3D Design & Test
- Using UML for Embedded System Specification
- Optical signals in communication and Information Processing
- CAD and EDA Tools, Methods and Algorithms
- Hardware Security and Design for Security
- Logic, Schematic and System Synthesis
- Place and Route
- Thermal and Electrostatic Analysis of SoCs
- Wireless and RFID Systems Synthesis
- Sensors and Transducers
- Medical Electronics
- Design of Integrated Passive Components
- Artificial Intelligence (Machine Learning, Neural Networks)
- Applied Informatics and Data Structures
Committees
- General Chairs
- V. Hahanov
- Y. Zorian
- General Vice-Chairs
- R. Ubar
- M. Jenihhin
- L. Miclea
- Z. Navabi
- Program Chairs
- S. Shoukourian
- A. Ivanov
- Program Vice-Chairs
- P. Prinetto
- A. Singh
- Finance Chairs
- E. Litvinova
- Publicity Chair
- G. Markosyan
- Steering Committee
- V. Hahanov
- P. Prinetto
- Y. Zorian
- Organizing Committee
- Z. Davitadze
- E. Litvinova
- A. Mishchenko
- Program Committee
- V. H. Abdullayev
- A. Barkalov
- D. Devadze
- Z. Dyka
- Gul Nihal Gugul
- G. Harutyunyan
- E. Jintcharadze
- I. Kabin
- K. Li
- V. Melikyan
- V. Miz
- V. Obrizan
- V. Opanasenko
- M. Palanichamy
- P. K. Saraswathi
- Z. Stamenkovic
- V. Vardanian
- A. Ziarmand
- F. Ugurdag